Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor

Product Details
Customization: Available
Conductive Type: Unipolar Integrated Circuit
Integration: MSI
Diamond Member Since 2024

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  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
  • Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
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  • Overview
  • Specification
  • Company Profile
  • FAQ
Overview

Basic Info.

Model NO.
Light EVM_47DR_INT board
Mounting Type
SMT
Operating Temperature
-20ºC~40ºC
Shape
Board
Technics
Application-Specific Integrated Circuit
Transport Package
ESD Bag
Specification
850mm*200mm
Trademark
Ragine
Origin
China
HS Code
8527990000
Production Capacity
900board/Year

Product Description

Light EVM_47DR_INT board, used in conjunction with EVM_47DR_COR

Specification
Product Features
1.Includes 6 FMC sub-board expansion ports
2. Each sub-board expansion port has an independent clock input port
Application Fields
Communications, Radar, and Test & Measurement Fields
Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
Technical Specifications

Product Model
EVM_47DR_INT
Supporting model
EVM_47DR_COR
Power
12VDC
Size
850mm*200mm
Peripheral Interface
6x FMC
1x J30J-66ZKWP7-J Power Input
J30J-51TJNV-JPower Input
FMC1 Peripheral Interface
10x SMP(Clock Input) ;
5xSMP;
6x J30J-51TJN-J Each; inclusion:15x RS422,2x RS232,8x GPIO;
6x J30J-15TJN-J Each inclusion:1x VCC_5V,2xTTL;
6x DAM.









Product Architecture

Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
Company Profile
Light Evm_47dr_Int Board, Used in Conjunction with Evm_47dr_Cor
ABOUT US
We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration
FAQ
Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.
Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.
Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.
Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).
Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.

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