High-Speed Data Acquisition & Fpga-Direct Nvme SSD Storage (8-Bay)

• Customization: Available
• Conductive Type: Unipolar Integrated Circuit
• Integration: MSI
• Model NO.: FPGA-Direct NVMe SSD Storage (8-Bay)
• Mounting Type: SMT
• Operating Temperature: -20ºC~40ºC
• Shape: Board
• Technics: Application-Specific Integrated Circuit
• Transport Package: ESD Bag
• Specification: 180*190mm
• Trademark: Ragine
• Origin: China
• HS Code: 8527990000
• Production Capacity: 900board/Year

Product Description

High-Speed Data Acquisition & FPGA-Direct NVMe SSD Storage (8-Bay)

High-Speed Data Acquisition and Storage: FPGA Direct-Write to NVMe SSD (8-Bay)
This system utilizes the XCVU9P as the master control chip, paired with 8 NVMe M.2 slots. Leveraging its abundant System Logic Cells and DSP slices, it delivers high-performance computing for complex algorithms and large-capacity storage capabilities.

Specification

Product Features
1.Abundant System Logic Cells and DSP Slice Resources

2.Equipped with 8 NVMe M.2 Slots for Massive Storage Capacity

3.9x 100G Ethernet with KR4 RS-FEC(Capable of correcting both burst errors and random errors during high-speed data transmission, significantly improving the reliability and noise immunity of Ethernet data transfer)
 

Application Fields
Real-time disk streaming of raw ADC-acquired data or preprocessed data in radar, communications, and electronic warfare applications.
 
 

Technical Specifications

GTY	120	RAM	6TB  8xDDR4(4Gb,16bit, 2133 MT/s)
DSP Slices	6,840	QSPI Flash	1Gb
System Logic Cells (K)	2,586	POWER	12VDC
Total Block RAM (Mb)	75.9	UltraRAM (Mb)	270
Peripheral Interface	.2x QSPI flash (512Mb,8bit)  .1x Type-C 1x JTAG(14pin) .1x 10pinTest Port 8x LED(Test Indicator (Light)) .2x XT30PW-M  .2x J30J-15ZKWP7-J,each of which contains2xRS422Input,2xRS422Output,4XGPIO .1x USB 3.0  .8x NVME .1x HSFMC

Technical Specifications

Company Profile

ABOUT US

We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration

FAQ

Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.