Vu5p + Agx Orin GPU Board with 275 Tops Computing Performance

• Customization: Available
• Conductive Type: Unipolar Integrated Circuit
• Integration: MSI
• Model NO.: VU5P + AGX Orin GPU board
• Mounting Type: SMT
• Operating Temperature: -20ºC~40ºC
• Shape: Board
• Technics: Application-Specific Integrated Circuit
• Transport Package: ESD Bag
• Specification: 175mm*155mm
• Trademark: Ragine
• Origin: China
• HS Code: 8527990000
• Production Capacity: 900board/Year

Product Description

VU5P + AGX Orin GPU board with 275 TOPS computing performance

VU5P+AGX Orin GPU Board (275 TOPS)
This computing platform utilizes the XCVU5P as the master control FPGA, integrated with an NVIDIA Jetson AGX Orin GPU module. The design incorporates:

Multiple high-speed peripheral interfaces;
High-efficiency data throughput architecture;
Optimized processing pipeline;
Delivering 275 TOPS of computational performance for data-intensive applications.

Specification

Applications

1.1x FMC (FPGA Mezzanine Card) expansion port

2.Up to 275 TOPS (Tera Operations Per Second)" 

Application Fields
Verification and implementation of signal processing algorithms for radar, communications, and electronic warfare systems.
 

 
Essential Matching Accessories
GPU-to-FPGA driver and interface driver

right elevation

left elevation

front elevation

Technical Specifications

PCIe	Gen3 x16 x4	size	175mm*155mm
QSPI Flash	1Gb	GTY	80
FPGA	8xDDR4(4Gb,128bit, 2133 MT/s)	System Logic Cells (K)	1,314
Total Block RAM (Mb)	36	power	28VDC
GPU-Side Interface	3x USB3.2(USB-A,Type-C,Micro-USB)  1x 10/100/1000 Ethernet 1x DP 1x M.2E 1x NVMe M.2   J30J-37ZKWP7-J	FPGA-Side Interface	1x QSPI flash (128MB,8bit)  1x QSFP 100G 1x NVMe M.2 1x MicroSD  1x USB_JTAG/UART J30J-25ZKWP7-J FMC+

Technical Specifications

Company Profile

ABOUT US

We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration

FAQ

Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.