Xilinx Vu13p-Based Decimation Signal Processing Board with High-Efficiency Data Throughput

• Customization: Available
• Conductive Type: Unipolar Integrated Circuit
• Integration: MSI
• Model NO.: Xilinx VU13P-Based Decimation Signal Processing Bo
• Mounting Type: SMT
• Operating Temperature: -20ºC~40ºC
• Shape: Board
• Technics: Application-Specific Integrated Circuit
• Transport Package: ESD Bag
• Specification: 200mm× 180mm
• Trademark: Ragine
• Origin: China
• HS Code: 8527990000
• Production Capacity: 900board/Year

Product Description

Xilinx VU13P-Based Decimation Signal Processing Board with High-Efficiency Data Throughput

The VU13P downsampling signal processing platform utilizes the Xilinx XCVU13P as the master control FPGA, implements numerous high-speed peripheral interfaces, and delivers exceptional data processing/computational capabilities with highly efficient data throughput.

Specification

Product Features
1.16x 100GbE Optical Ports for High-Speed Data Transmission;

2.Abundant FPGA Resources: High-Density System Logic Cells & DSP Slices;

3.9x 100GbE Interfaces with KR4 RS-FEC: Enhances reliability by correcting burst/random errors in high-speed links.
 

Application Fields
Fields including Communications, Radar, and Test & Measurement.
 

back elevation

left elevation

front elevation

Technical Specifications

GTY	128	Channel count	8T8R
System Logic Cells (K)	930	Total Block RAM (Mb)	94.5
UltraRAM (Mb)	360.0	QSPI Flash	4Gb
POWER	28VDC	RAM	8x DDR4(8Gb,64bit, 2133 MT/s)
PS Interfaces	1x Type-C Debug Interface  16x QSFP 100G 1x SFP+ 10G J30J-31ZKWP7-J J30J-37ZKWP7-J 1x 12T,12R HTG8532-MH-T001YY

Technical Specifications

Company Profile

ABOUT US

We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration

FAQ

Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.