High-Speed Data Acquisition and Storagefpga, Direct Write to Nvme SSD (Dual-Bay)

• Customization: Available
• Conductive Type: Unipolar Integrated Circuit
• Integration: MSI
• Model NO.: High-Speed Data Acquisition & Storage FPGA Direct-
• Mounting Type: SMT
• Operating Temperature: -20ºC~40ºC
• Shape: Board
• Technics: Application-Specific Integrated Circuit
• Transport Package: ESD Bag
• Specification: 160*100mm
• Trademark: Ragine
• Origin: China
• HS Code: 8527990000
• Production Capacity: 900board/Year

Product Description

High-Speed Data Acquisition and StorageFPGA ,Direct Write to NVMe SSD (Dual-Bay)

High-Speed Data Acquisition and Storage System.This FPGA-based system features direct writing to dual NVMe SSDs, comprising:

XCZU7EV FPGA;
High-speed DDR4 buffer memory;
PCIe Gen3 hard IP core;
High-speed NVMe interface;
QSFP28 100Gbps optical port.
Key capabilities:

Real-time recording and playback of ADC-acquired data.
Network interface for:

Receiving storage control commands;
Providing storage status feedback;
FPGA-direct NVMe architecture eliminates host CPU bottlenecks.

Specification

Product Features

1.4TB High-Capacity Storage with FPGA-optimized implementation of:

/High-performance NVMe protocol stack

/PCIe 3.0 interface stack,Supports high-speed data access with sustained sequential read/write speeds of 3GB/s per board.

2.High-Speed Optical Interfaces:

/1× 100Gbps QSFP28 port
/4× 10Gbps SFP+ ports
Enables:
*Real-time recording and playback of ADC-acquired data
*Network communication for:

*Receiving storage control commands
*Providing storage status feedback

 
Application Fields
Real-Time Disk Streaming of ADC-Acquired Data for Radar, Communications & EW Systems.
 
Essential Matching Accessories
Supports rate scalability with selectable real-time storage speeds: 6GB/s, 12GB/s, 18GB/s, 24GB/s, and 30GB/s.

right elevation

left elevation

front elevation

Technical Specifications

ARM	Quad-core Cortex-A53,Dual-core Cortex-R5	Read-Write Rate	3GB/s
PCIe	Gen3 x16 x2	System Logic Cells (K)	504
QSPI Flash	512Mb	DSP Slices	1,728
Memory	PS 5x DDR4(10GB,80bit)  PL 2x DDR4(4GB,32bit)	Total Block RAM (Mb)	11
board size	160mm*100mm	Power	12VDC
PS-Side Interface	1x QSPI flash(64MB,8bit) 1x EMMC flash 2x 10/100/1000 Ethernet	PL-Side Interface	1x QSFP28 100G 4x SFP+ 10G 2x NVME 1x J30JZLN25ZKWA000 1x J30J-9ZKWP7-J

Technical Specifications

Company Profile

ABOUT US

We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration

FAQ

Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.