Xc7z100-2ffg900-Based Evm_47dr_Cor Digital Array Board

• Customization: Available
• Conductive Type: Unipolar Integrated Circuit
• Integration: MSI
• Model NO.: EVM_47DR_COR
• Mounting Type: SMT
• Operating Temperature: -20ºC~40ºC
• Shape: Board
• Technics: Application-Specific Integrated Circuit
• DSP Slices: 4,272
• Gty: 16
• Transport Package: ESD Bag
• Specification: 850mm*180mm
• Trademark: Ragine
• Origin: China
• HS Code: 8527990000
• Production Capacity: 900board/Year

Product Description

EVM_47DR_COR Digital Array Board

The EVM_47DR_COR digital array board uses the XC7Z100-2FFG900 as the main controller, paired with two XC7K325TFBG900 chips, and builds high-speed peripheral interfaces according to requirements to achieve the platform's data processing and computing capabilities.

Specification

Product Features

1.Supports 2-channel FMC expansion ports

Application Fields

Communications, Radar, and Test & Measurement Fields

Technical Specifications

Product Model	EVM_47DR_COR	Supporting model	XCZU47DR
System Logic Cells (K)	930	Total BlockRAM (Mb)	38
DSP Slices	4,272	UltraRAM (Mb)	22
GTY	16	QSPI Flash	2Gb
Raw	PS 2xDDR3(1GB,16bit, 2133MT/s)	Power	12VDC
PS terminal interface	2x QSPI flash(256MB,8bit)  1x Type-C 1x JTAG 1x 10/100/1000 Ethernet RGMII (RJ45)	6x FMC	The 5-channel FMC each includes: 90x RS422 (72 outputs, 18 inputs), 12x RS232, 48x GPIO (42 inputs, 6 outputs), 12x TTL, 36x DAM. Another FMC includes: 30x RS422 (24 outputs, 6 inputs), 4x RS232, 16x GPIO (14 inputs, 2 outputs), 4x TTL, 12x DAM. 2x J30J-37ZKWP7-J: each includes: 16x RS422 (12 outputs, 4 inputs), 1x RS232.

Product Architecture

Company Profile

ABOUT US

We specializing in delivering high-performance mixed-signal array system solutions for radar, communications, and electronic warfare applications.
Product Portfolio:Broadband Radar Signal Acquisition Module / Ultra-High-Speed Real-Time Storage Module / FPGA-GPU Heterogeneous Processing Module, etc.
Custom Solutions: Full-stack development services spanning hardware design, signal processing algorithms, and system integration.
Technology Focus Areas:
1.RF Digitization
2.All-Digital Array Architecture
3.Intelligent Integration

FAQ

Q: What’s the lead time for orders?
A: Standard models ship in 15–30 days; customized units require 30–45 days.

Q: Do you provide after-sales service overseas?
A: Yes, we have partnered service centers in key regions.

Q: Can I request a customized bucket size?
A: Absolutely! We offer tailored attachments.

Q: What documents do you provide for export?
A: Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).

Q: How do I place an order?
A: Contact us via email/phone for a quote, then confirm with a PO.